STOCKREPORTS |
Novellus Systems, Inc. | Nasdaq Symbol NVLS In S&P SmallCap 600 |
| 19-JUL-97 | Industry: Equipment (Semiconductor) |
Summary: This company manufactures, markets and services automated wafer fabrication systems for chemical vapor deposition (CVD) of thin films used in semiconductor manufacturing. |
| Recent Price 52 Wk Range |
Yield 12-Mo. P/E |
| Quantitative Evaluation: Outlook (1 Lowest - 5 Highest) Fair Value Risk Earn/Div Rank |
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| Technical Evaluation: Rel. Strength Rank (1 Lowest - 99 Highest) Insider Activity |
Overview 02-JUN-97
Valuation 02-JUN-97
Key Stock Statistics
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Fiscal Year Ending Dec. 31
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Dividend Data: No cash dividends have been paid. The shares were split two for one in 1990.
Business Summary 02-JUN-97
The company's objective is to increase its market share in the worldwide CVD market and strengthen its position as a leading supplier of semiconductor processing equipment. To attain this goal, the company's strategy is to provide its customers with systems that achieve the highest levels of wafer throughput, yield (the percentage of functioning ICs to the total produced), and film quality. In addition, the company plans to maintain a leadership position in CVD technology, to allow its systems to utilize the most advanced CVD processes. Finally, NVLS will focus its marketing efforts on major semiconductor manufacturers. The company has sold at least one CVD system to each of the 20 largest semiconductor manufacturers in the world. The company's CVD products include the Concept One-Dielectric system, which can deposit a variety of insulating films on a wafer. A modified version, the Concept One-W, deposits tungsten metal on wafers. The tungsten acts as a metal interconnect between conductor layers in an IC. The Concept Two is a modular, integrated CVD system that can deposit both dielectric and conductive metal layers by combining one or more processing chambers around a common, automated robotic wafer handler. The Concept Two-ALTUS combines the modular architecture of the Concept Two system with an advanced tungsten CVD process chamber. The Concept Two-Dual ALTUS, with a dual advanced tungsten CVD process chamber, addresses state-of-the-art, 0.35-micron linewidth processing needs. In 1996, NVLS introduced Speed, its high-density plasma deposition tool for 0.35-micron linewidth ICs and below. Novellus settled a longstanding legal matter with Applied Materials (Nasdaq: AMAT), the company's chief competitor, in May 1997. In April 1997, a jury in a U.S. District Court ruled against the company in a patent infringement suit filed by AMAT. Under terms of the agreement, NVLS agreed to pay AMAT $80 million and a royalty for all future revenues of TEOS-based systems, which is the process that was the subject of the lawsuit. In May 1997, NVLS entered the market for physical vapor deposition systems (PVD) through the acquisition of the Thin Film Systems business of Varian Associates Inc. (NYSE: VAR) for $150 million in cash.
Capitalization
Long Term Debt:
None (3/97).
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| Curr. Ratio | 4.3 | 3.5 | 4.6 | 4.3 | 5.7 | 6.2 | 5.1 | 4.5 | 3.3 | 1.5 |
| % LT Debt of Cap. | NM | NM | Nil | Nil | 0.9 | 1.2 | 0.7 | 1.9 | 4.2 | 19.9 |
| % Net Inc.of Revs. | 20.4 | 22.1 | 20.0 | 14.2 | 8.9 | 21.0 | 20.9 | 22.1 | 11.0 | NM |
| % Ret. on Assets | 22.8 | 26.0 | 21.7 | 13.9 | 6.6 | 20.1 | 23.1 | 28.6 | 9.4 | NM |
| % Ret. on Equity | 29.1 | 33.9 | 26.9 | 16.9 | 7.7 | 24.0 | 28.8 | 38.0 | NM | NM |
Data as orig. reptd.; bef. results of disc. opers. and/or spec. items. Per share data adj. for stk. divs. as of ex-div. date. E-Estimated. NA-Not Available. NM-Not Meaningful. NR-Not Ranked.
Office--81 Vista Montana, San Jose, CA 95134. Tel--(408) 943-9700. Chrmn, Pres & CEO--R. S. Hill. VP & CFO--R. H. Smith Treas--J. Root. Dirs-- D. J. Guzy, R. S. Hill, T. Long, G. Possley, R. H. Smith, J. Van Poppelen. Transfer Agent & Registrar--Chemical Trust Co. of California, San Francisco. Incorporated--in California in 1984. Empl-- 1,143. S&P Analyst: Stephen T. Madonna, CFA
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