Magazine

Table: How UMC Is Riding Out the Downturn


-- Slash capital expenditures on new chip plants, especially those making old-generation 8-in. silicon wafers

-- Push to close the technology gap with industry leader TSMC by going ahead with partnerships to make cutting-edge 12-in. wafers and chips with line widths of under 0.1 micron.

-- Reduce costs through such measures as cutting employee bonuses to show investors it is serious about profit margins.

-- Convey honesty with investors by speaking candidly about the depth of the chip slump.

DATA: BusinessWeek


Steve Ballmer, Power Forward
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