-- Slash capital expenditures on new chip plants, especially those making old-generation 8-in. silicon wafers
-- Push to close the technology gap with industry leader TSMC by going ahead with partnerships to make cutting-edge 12-in. wafers and chips with line widths of under 0.1 micron.
-- Reduce costs through such measures as cutting employee bonuses to show investors it is serious about profit margins.
-- Convey honesty with investors by speaking candidly about the depth of the chip slump.
Copyright 2001, Bloomberg L.P.
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