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Amkor Technology
(NasdaqNM: AMKR)
USA
Although not nearly as well-known as Intel or Texas Instruments, Amkor Technology is a longtime player in the global semiconductor game. The company, founded in 1968, pioneered the business of outsourcing semiconductor assembly and testing. It takes silicon wafers made by other manufacturers, cuts them into individual chips, and puts in a protective housing that allows the chips to properly connect to the other electronics in the device. Chipmakers have been relying on independent assemblers such as Amkor to a greater degree as semiconductors get smaller, more complex, and product life cycles shrink. By handling the work for a variety of companies, Amkor can spread its investment over a larger base. Since 2001, the Chandler (Ariz.) company has expanded its operations to include more than 5 million square feet of manufacturing facilities near customers in China, Taiwan, Singapore, and Japan. Amkor chips can be found in wide array of products such as laptops, digital cameras, MP3 players, and video games. Customers include IBM, Samsung, Sony, and Toshiba. In this year's first quarter, Amkor's sales jumped 55%, to $645 million. That increased volume helped the company report a net profit of $36 million, vs. a loss of $119 million during the same period last year.
Company Info |
|
| 2005 Rank | Not Ranked |
| Sales* ($ Millions) | 2,327.6 |
| Sales Growth (over prev. year) |
26 % |
| Profits* ($ Millions) | 16.9 |
| Return on Equity | 6.5 % |
| Total Return on Sales (12-mo.) | 167.1 |
| Share Price As of 5/31/06 | 9.51 |
| CURRENT MARKET INFO | NasdaqNM: AMKR |
| No. of Employees | 24,000 |
| Industry | Semiconductors |
| COMPANY WEB SITE > | |
*Trailing 12 months
Stock price data as of 5/31/06
DATA: Standard & Poor's Compustat
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Company Snapshot
Amkor Technology provides advanced semiconductor assembly and test services in the U.S. and internationally. It offers a range of package formats and services primarily in leadframe and laminate families. Its leadframe package types comprise SOIC and QFP, which support various device types and applications, as well as leadframe package offerings that consist of MicroLeadFrame family of QFN or Quad Flat No-lead packages for radio frequency and wireless applications. The company's laminate products include SuperBGA, which is designed for low-profile, high-power applications; TEPBGA-2, which is designed for thermal performance in high-power applications; and System-in-Package modules, which integrate various system elements into a single-function block. It also offers turnkey flip chip solutions, including wafer probe, wafer bumping, packaging, and test and drop ship on 200mm and 300mm wafers, as well as provides outsourced packages based on MEMS that are used in a range of industrial and consumer applications, including automobiles and home entertainment. In addition, the company provides various test solutions, including wafer probe, final test, strip test, marking, bake, dry pack, and tape and reel, as well as drop shipment for various devices, including digital, linear, mixed signal, memory, and radio frequency. Further, it offers engineering services, which include conversion of single site to multisite, test program development, test hardware development, and test program conversion. Amkor has strategic manufacturing partnerships with various semiconductor companies and electronics original equipment manufacturers for the provision of package design, assembly, and test solutions. The company's operational base encompasses manufacturing facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe, and the U.S. Amkor was founded in 1968 and is headquartered in Chandler, Ariz.
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